Expert Features

• 14.8 W/m·K Thermal Conductivity: High-performance thermal interface material designed to transfer heat between electronic components and compatible cooling surfaces.
• 0.5 mm Precision Thickness: Ultra-thin silicone pad for cooling assemblies specifically requiring a 0.5 mm thermal gap interface.
• 85 × 45 mm Compact Sheet: Convenient rectangular format for smaller thermal-management applications and precision electronics repairs.
• Electrically Insulating: Non-electrically conductive silicone helps reduce short-circuit risks when installed near sensitive electronic components.
• High Compressibility: Soft silicone construction conforms to minor surface irregularities under suitable heatsink mounting pressure.
• GPU VRAM & VRM Cooling: Suitable for compatible graphics-card memory chips and voltage-regulation components requiring this specific thickness.
• SSD & Motherboard Applications: Can be trimmed for suitable M.2 SSDs, motherboard chipsets, memory components, and integrated circuits.
• Wide Operating Temperature Range: Manufacturer-rated temperature stability from −50°C to +250°C.
• Clean, Pre-Formed Installation: Cut to the required dimensions, remove protective films, and position without spreading thermal grease.
• Non-Curing Silicone Formula: Flexible thermal interface material designed to remain non-curing rather than hardening into a rigid adhesive layer.
• Custom Cut-to-Fit Design: Easily trim the 85 × 45 mm sheet to match individual component footprints and contact surfaces.
• Laptop & Desktop Servicing: Practical for compatible gaming PCs, graphics cards, laptops, workstations, and electronics repair.

Expert Specs

Installation Note: The 0.5 mm thickness must match the original thermal interface gap. A pad that is too thin may not contact both surfaces, while one that is too thick can interfere with heatsink seating. This pad is not automatically a replacement for thermal paste directly on a CPU or GPU die.