Expert Features

• Extremely High Compressibility: Designed to compress significantly under mounting pressure, allowing a single pad thickness to accommodate varying component height differences.
• Excellent Thermal Conductivity Under Pressure: Maintains—and can even improve—thermal conductivity when compressed, ensuring efficient heat transfer in demanding setups.
• Ideal For GPU Water Cooling Conversions: Particularly practical for graphics card modifications where multiple components such as VRAM and VRMs require consistent thermal contact.
• Single Thickness Multi-Surface Coverage: One pad can be used simultaneously across memory chips, voltage regulators, and other contact points within the same assembly.
• Height Tolerance Adaptation: Effectively compensates for uneven component heights as long as sufficient contact pressure and lateral expansion space are available.
• Electrically Non-Conductive Material: Safe for use around sensitive electronic components without risk of electrical short circuits.
• Optimized For Unknown Pad Thickness Scenarios: Well-suited for replacements when the exact factory pad thickness is uncertain, using slightly thicker pads that compress into place.
• Controlled Compression Behavior: Expands laterally along the X and Y axes under pressure, enabling seamless surface contact across components.
• Easy To Handle And Install: Flexible silicone material allows straightforward cutting, positioning, and mounting during system assembly or modification.
• High Versatility Of Use: Suitable for GPUs, SSDs, voltage regulators, and other heat-generating components where contact pressure is sufficient.

Expert Specs