Expert Features

• 11.5 W/m·K Thermal Conductivity: High-performance thermal putty helps transfer heat between electronic components and compatible cooling surfaces.
• 100g Pink Thermal Putty: Generous quantity of distinctly pink, moldable thermal-interface material for electronics servicing and custom gap-filling applications.
• Excellent Gap-Filling Performance: Soft putty conforms to uneven surfaces and varying component heights, helping eliminate insulating air gaps.
• GPU VRAM & VRM Cooling: Suitable for compatible graphics-card memory chips and voltage-regulation components that require a compressible gap-filling material.
• Non-Curing Formula: Remains soft and moldable instead of permanently hardening, supporting servicing and component rework.
• Electrically Non-Conductive: Insulating formulation helps minimize electrical short-circuit risks in densely populated electronic assemblies.
• High Compressibility: Adapts to irregular contact surfaces under suitable heatsink pressure, helping maintain effective thermal contact.
• Wide Operating Temperature Range: Manufacturer-rated operating range of −40°C to +200°C for electronic thermal-management applications.
• Long-Term Material Stability: Designed to resist drying and pump-out during service, helping maintain a stable thermal interface.
• Easy Application & Removal: Moldable consistency allows technicians to place and shape the required quantity without cutting rigid thermal pads.
• Gaming Console & Laptop Cooling: Suitable for appropriate thermal interfaces in consoles, laptops, and compact gaming electronics.
• SSD & Power Electronics Cooling: Designed for compatible SSD controllers, memory modules, power-supply components, LED drivers, and other electronic assemblies.
• Service-Friendly Design: Non-curing material supports maintenance and rework; contaminated or removed material should not automatically be reused.

Expert Specs