Expert Features

• 14.8 W/m·K Thermal Conductivity: High-performance silicone thermal interface designed to transfer heat between electronic components and compatible cooling surfaces.
• 2.0 mm Precision Thickness: Pre-formed thermal pad for assemblies requiring a 2.0 mm gap-filling interface between components and heatsinks.
• 120 × 20 mm Long Strip: Narrow rectangular format with an exact 6:1 length-to-width ratio, suitable for elongated thermal contact areas.
• Electrically Insulating: Non-electrically conductive silicone material helps reduce the risk of electrical contact through the pad around sensitive electronic components.
• Flexible Silicone Construction: Conformable thermal material helps accommodate minor surface irregularities under appropriate heatsink pressure.
• GPU VRAM & VRM Cooling: Suitable for compatible graphics-card memory chips and voltage-regulation components requiring the correct pad thickness.
• M.2 SSD & Motherboard Applications: Can be trimmed for suitably sized SSDs, chipsets, memory modules, and integrated circuits.
• Wide Operating Temperature Range: Manufacturer-specified operating temperature range of −50°C to +250°C.
• Clean, Pre-Formed Installation: Cut to size, remove the protective films, and position between the component and its cooling surface without spreading thermal grease.
• Non-Curing Silicone Material: Remains a non-curing thermal interface rather than hardening into a rigid compound.
• Custom Cut-to-Fit Design: The long strip can be divided into smaller pieces according to individual component footprints.
• Laptop & Desktop Thermal Servicing: Practical for compatible graphics cards, gaming PCs, laptops, workstations, and electronics repairs where a 2.0 mm pad is required.